Crosstalk-Free 3D IC TSV Automatic Placement

Hou Ligang; Li Chunqiao; Bai Shu; Wang Jinhui; Diao Luhong; Liu Weiping

Hou Ligang, Li Chunqiao, Bai Shu, Wang Jinhui, Diao Luhong, Liu Weiping. Crosstalk-Free 3D IC TSV Automatic Placement[J]. Journal of Computer-Aided Design & Computer Graphics, 2013, 25(4): 578-583.

Citation:

Hou Ligang, Li Chunqiao, Bai Shu, Wang Jinhui, Diao Luhong, Liu Weiping. Crosstalk-Free 3D IC TSV Automatic Placement[J]. Journal of Computer-Aided Design & Computer Graphics, 2013, 25(4): 578-583.

Citation:

Hou Ligang, Li Chunqiao, Bai Shu, Wang Jinhui, Diao Luhong, Liu Weiping. Crosstalk-Free 3D IC TSV Automatic Placement[J]. Journal of Computer-Aided Design & Computer Graphics, 2013, 25(4): 578-583.

Crosstalk-Free 3D IC TSV Automatic Placement

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A crosstalk-free 3D IC through silicon via(TSV) automatic placement algorithm is presented in this paper.The principle of TSV crosstalk and the effectiveness of grounded TSV shielding was proved by using Comsol.Then effectiveness of grounded TSV was quantified with a deduced formula.Power/Ground TSV and signal TSV placement algorithm has been realized, considering the impact of TSV percentage and pinch constraint on 3D IC performance.Finally, the experimental results on IBM benchmark circuits validated and verified the proposed algorithm.

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Crosstalk-Free 3D IC TSV Automatic Placement

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