Solder Joint Location Method Based on Color Feature and Neighborhood Information

In order to prevent the integrated circuit from inter-inference or external interference of the components, it is necessary to keep the high integration circuit board in the insulated encapsulation. Considering the current Printed Circuit Board（PCB） requires small welding, large quantity, intensive distribution, varied shapes, a color feature and neighborhood information based method is proposed in this paper. A color feature model is first established to extract the features of chromaticity interval and color difference. Afterwards, the multi-shaped solder joints location method based on the color feature is proposed to determine the location of the solder joints. On the basis of solder joint positioning, the window scanning is used to extract the neighborhood information of pixel points. The solder joint location is further optimized based on the neighborhood information, where the positioning accuracy of the PCB solder joint area is improved effectively. It is shown from the test results that the precise positioning requirements of the multi-pattern solder joint area on the PCB could be fulfilled as the proposed method could effectively improve the filling rate of the solder joint areas yet reduce numbers of the misplaced pixel points.