Abstract: Multi-tower three dimensional stacked integrated circuits(3D-SIC) have a prolonged test time. This work proposes a test scheduling method of 3D-SIC based on quantum-behaved particle swarm optimization(QPSO) to reduce the test time. Firstly, it constructs an initial particle swarm that represents the feasible solutions; then it generates the new quantum-behaved particle and updates the particle swarm based on the fitness values and the constraints; finally, it approximates the optimal scheduling solution till the end of the swarm evolution. The experimental results on the final stack and the integration process show that this method reduces the test time of 3D-SIC obviously. The test time is shorter for the stacked final 3D-SIC, and vice versa for the 3D-SIC integration process, if the complex die is integrated as the bottom die.