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层次化共享多通道便签存储器的嵌入式多核体系

Hierarchical Shared Multi-channel Scratch Pad Memory Architecture for Embedded MPSoC

  • 摘要: 为了支持嵌入式应用的实时、低延迟访存,提出并实现了一种面向嵌入式应用的多核存储架构——HSMC-SPM.采用低地址多体交叉的硬件组织模式设计实现可共享多通道便签存储器,根据并发应用的大小自动分配共享便签存储器空间,以支持核间数据的流水传输并提高共享便签存储器体系存储空间的利用率.实验结果表明,无论与传统只共享Cache的多核体系相比,还是与其他使用片上便签存储器的多核体系相比,HSMC-SPM都是一种性能有效的低能耗多核架构.

     

    Abstract: To support the real-time and low latency memory accesses of embedded applications, a kind of CMP memory architecture is proposed. The sharable multi-channel scratch pad memory is designed and implemented to be multi-access cross memory. The shared multi-channel scratch pad memory (SPM) space is automatically distributed to concurrent applications according to the size. Both of the above design schemes aim on improving the utilization of the shared SPM space. The experimental results indicate that no matter what to compare with shared Cache architecture or to compare with the state-of-the-art, HSMC-SPM is a kind of low-power and performance-efficient CMP memory architecture.

     

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