Hybrid Fault-Tolerant Method for TSV Based on Group Sharing in 3D NoC
Ouyang Yiming1), Chen Qi1), Huang Zhengfeng2), Liang Huaguo2), Du Gaoming3), and Li Jianhua1)
1) (School of Computer and Information, Hefei University of Technology, Hefei 230009) 2) (School of Electronic Science & Applied Physics, Hefei University of Technology, Hefei 230009)3) (School of Microelectronics, Hefei University of Technology, Hefei 230009)
Redundancy and serialization are two main solutions to solve the fault problems of TSV, however, use only one of the two methods will face the problems of resource waste and low efficiency of fault tolerance. To this end, we propose a hybrid fault-tolerant method for TSV based on group sharing in 3D NoC. Firstly, TSVs are divided into four groups, and every two groups is an adjacent group in which we achieve TSV groups sharing. Secondly, based on TSV groups sharing, rational allocation and efficient utilization of resources, we design a novel TSV redundancy and serialization architecture. Lastly, depending on the failure extent of TSV, we adaptively select the redundant mechanism or the serialization mechanism to achieve the hybrid fault-tolerance for TSV. Experimental results show that, the proposed method improves the performance more obviously compared with the pure redundancy mechanism or the pure serialization mechanism.
3D NoC; group sharing; fault-tolerant; through silicon vias