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ISSN      1003-9775
CN        11-2925/TP
邮发代号:82-456
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3D NoC中基于分组共享的TSV混合容错方法

欧阳一鸣1), 陈 奇1), 黄正峰2), 梁华国2), 杜高明3), 李建华1)
1) (合肥工业大学计算机与信息学院 合肥 230009)2) (合肥工业大学电子科学与应用物理学院 合肥 230009)3) (合肥工业大学微电子学院 合肥 230009)
分类号: TP391.41
出版年,卷(期):页码: 2017 , 29 ( 11 ): 2123-2132 欧阳一鸣
摘要: 冗余和串行化是解决硅通孔(TSV)的故障问题的2种主要方法, 仅使用其中一种方法会面临资源浪费和容错效率低等问题. 为此, 提出一种3D NoC中基于分组共享的TSV混合容错方法. 首先将TSV分成4组, 并且每2组为一个相邻组, 相邻组内实现TSV分组共享; 然后基于分组共享, 充分考虑资源的合理配置, 高效利用资源设计一种新型的TSV冗余和串行化架构; 最后根据TSV故障程度的不同自适应地选择冗余机制或者串行化机制, 实现TSV的混合容错. 实验结果表明, 与单纯地使用冗余机制和串行化机制相比, 该方法在性能提升上更明显.
关键词: 3D NoC; 分组共享; 容错; 硅通孔
Hybrid Fault-Tolerant Method for TSV Based on Group Sharing in 3D NoC
Ouyang Yiming1), Chen Qi1), Huang Zhengfeng2), Liang Huaguo2), Du Gaoming3), and Li Jianhua1)
1) (School of Computer and Information, Hefei University of Technology, Hefei 230009) 2) (School of Electronic Science & Applied Physics, Hefei University of Technology, Hefei 230009)3) (School of Microelectronics, Hefei University of Technology, Hefei 230009)
abstract: Redundancy and serialization are two main solutions to solve the fault problems of TSV, however, use only one of the two methods will face the problems of resource waste and low efficiency of fault tolerance. To this end, we propose a hybrid fault-tolerant method for TSV based on group sharing in 3D NoC. Firstly, TSVs are divided into four groups, and every two groups is an adjacent group in which we achieve TSV groups sharing. Secondly, based on TSV groups sharing, rational allocation and efficient utilization of resources, we design a novel TSV redundancy and serialization architecture. Lastly, depending on the failure extent of TSV, we adaptively select the redundant mechanism or the serialization mechanism to achieve the hybrid fault-tolerance for TSV. Experimental results show that, the proposed method improves the performance more obviously compared with the pure redundancy mechanism or the pure serialization mechanism.
keyword: 3D NoC; group sharing; fault-tolerant; through silicon vias
 
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